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国家重点基础研究发展计划(2014CB339900)

作品数:20 被引量:28H指数:3
相关作者:杨银堂段宝兴袁嵩袁小宁曹震更多>>
相关机构:西安电子科技大学中国科学院国网信息通信产业集团有限公司更多>>
发文基金:国家重点基础研究发展计划国家自然科学基金国家电网公司科技项目更多>>
相关领域:电子电信理学化学工程自动化与计算机技术更多>>

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20 条 记 录,以下是 1-10
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Design and implementation of a high-efficiency concurrent dual-band power amplifier
2014年
This paper studies the behaviors of power amplifier(PA) driven by a single-carrier continuous wave(CW) signal and a two-carrier CW signal both in theory and simulation, and explains why the traditional dual-band PA failed to perform satisfactory results when a two-carrier CW signal is applied to, called concurrently. Besides that, an evaluation standard of concurrent dual-band PA was presented to value its performance. Solution was given with design and fabrication of a concurrent 1.85 GHz/2.65 GHz class F PA, employing a 10 W GaN HEMT device from Cree, CGH40010, whose measurement shows the saturated output power is 40.6 d Bm and 40.8dB m with drain efficiencies(DE) of 77.4% and 75.3% at 1.85 GHz and 2.65 GHz, respectively. On the other hand, we see that the peak DE achieves 59.7% with an output power of 39.9 dB m in concurrent mode, which follows up with the standard.
YANG Qian-kunLIU Yuan-anYU Cui-pingLI Shu-lanLI Jiu-chao
关键词:双频带饱和输出功率HEMT器件
阶梯AlGaN外延新型Al_(0.25)Ga_(0.75)N/GaN HEMTs器件实验研究
2015年
本文报道了作者提出的阶梯AlGaN外延层新型AlGaN/GaN HEMTs结构的实验结果.实验利用感应耦合等离子体刻蚀(ICP)刻蚀栅边缘的AlGaN外延层,形成阶梯的AlGaN外延层结构,获得浓度分区的沟道2DEG,使得阶梯AlGaN外延层边缘出现新的电场峰,有效降低栅边缘的高峰电场,从而优化了AlGaN/GaN HEMTs器件的表面电场分布.实验获得了阈值电压-1.5V的新型AlGaN/GaN HEMTs器件.经过测试,同样面积的器件击穿电压从传统结构的67V提高到新结构的106V,提高了58%左右;脉冲测试下电流崩塌量也比传统结构减少了30%左右,电流崩塌效应得到了一定的缓解.
袁嵩段宝兴袁小宁马建冲李春来曹震郭海军杨银堂
关键词:ALGAN/GAN表面电场击穿电压电流崩塌
Simulation and experimental study of high power microwave damage effect on AlGaAs/InGaAs pseudomorphic high electron mobility transistor被引量:8
2015年
The high power microwave(HPM) damage effect on the Al Ga As/In Ga As pseudomorphic high electron mobility transistor(p HEMT) is studied by simulation and experiments. Simulated results suggest that the HPM damage to p HEMT is due to device burn-out caused by the emerging current path and strong electric field beneath the gate. Besides, the results demonstrate that the damage power threshold decreases but the energy threshold slightly increases with the increase of pulse-width, indicating that HPM with longer pulse-width requires lower power density but more energy to cause the damage to p HEMT. The empirical formulas are proposed to describe the pulse-width dependence. Then the experimental data validate the pulse-width dependence and verify that the proposed formula P = 55τ-0.06 is capable of quickly and accurately estimating the HPM damage susceptibility of p HEMT. Finally the interior observation of damaged samples by scanning electron microscopy(SEM) illustrates that the failure mechanism of the HPM damage to p HEMT is indeed device burn-out and the location beneath the gate near the source side is most susceptible to burn-out, which is in accordance with the simulated results.
于新海柴常春刘阳杨银堂席晓文
关键词:高电子迁移率晶体管高功率微波砷化铟镓PHEMT扫描电子显微镜
新型缓冲层分区电场调制横向双扩散超结功率器件被引量:1
2014年
为了突破传统横向双扩散金属-氧化物-半导体器件(lateral double-diffused MOSFET)击穿电压与比导通电阻的极限关系,本文在缓冲层横向双扩散超结功率器件(super junction LDMOS-SJ LDMOS)结构基础上,提出了具有缓冲层分区新型SJ-LDMOS结构.新结构利用电场调制效应将分区缓冲层产生的电场峰引入超结(super junction)表面而优化了SJ-LDMOS的表面电场分布,缓解了横向LDMOS器件由于受纵向电场影响使横向电场分布不均匀、横向单位耐压量低的问题.利用仿真分析软件ISE分析表明,优化条件下,当缓冲层分区为3时,提出的缓冲层分区SJ-LDMOS表面电场最优,击穿电压达到饱和时较一般LDMOS结构提高了50%左右,较缓冲层SJ-LDMOS结构提高了32%左右,横向单位耐压量达到18.48 V/μm.击穿电压为382 V的缓冲层分区SJ-LDMOS,比导通电阻为25.6 mΩ·cm2,突破了一般LDMOS击穿电压为254 V时比导通电阻为71.8 mΩ·cm2的极限关系.
段宝兴曹震袁嵩袁小宁杨银堂
关键词:击穿电压比导通电阻
GaN高电子迁移率晶体管强电磁脉冲损伤效应与机理被引量:4
2016年
提出了一种新型GaN异质结高电子迁移率晶体管在强电磁脉冲下的二维电热模型,模型引入材料固有的极化效应,高场下电子迁移率退化、载流子雪崩产生效应以及器件自热效应,分析了栅极注入强电磁脉冲情况下器件内部的瞬态响应,对其损伤机理和损伤阈值变化规律进行了研究.结果表明,器件内部温升速率呈现出"快速-缓慢-急剧"的趋势.当器件局部温度足够高时(2000 K),该位置热电子发射与温度升高形成正反馈,导致温度急剧升高直至烧毁.栅极靠近源端的柱面处是由于热积累最易发生熔融烧毁的部位,严重影响器件的特性和可靠性.随着脉宽的增加,损伤功率阈值迅速减小而损伤能量阈值逐渐增大.通过数据拟合得到脉宽τ与损伤功率阈值P和损伤能量阈值E的关系.
刘阳柴常春于新海樊庆扬杨银堂席晓文刘胜北
关键词:GAN高电子迁移率晶体管
具有部分本征GaN帽层新型AlGaN/GaN高电子迁移率晶体管特性分析被引量:3
2017年
为了优化传统Al GaN/GaN高电子迁移率晶体管(high electron mobility transistors,HEMTs)器件的表面电场,提高击穿电压,本文提出了一种具有部分本征GaN帽层的新型Al GaN/GaN HEMTs器件结构.新型结构通过在Al GaN势垒层顶部、栅电极到漏电极的漂移区之间引入部分本征GaN帽层,由于本征GaN帽层和Al GaN势垒层界面处的极化效应,降低了沟道二维电子气(two dimensional electron gas,2DEG)的浓度,形成了栅边缘低浓度2DEG区域,使得沟道2DEG浓度分区,由均匀分布变为阶梯分布.通过调制沟道2DEG的浓度分布,从而调制了Al GaN/GaN HEMTs器件的表面电场.利用电场调制效应,产生了新的电场峰,且有效降低了栅边缘的高峰电场,Al GaN/GaN HEMTs器件的表面电场分布更加均匀.利用ISE-TCAD软件仿真分析得出:通过设计一定厚度和长度的本征GaN帽层,Al GaN/GaN HEMTs器件的击穿电压从传统结构的427 V提高到新型结构的960 V.由于沟道2DEG浓度减小,沟道电阻增加,使得新型Al GaN/GaN HEMTs器件的最大输出电流减小了9.2%,截止频率几乎保持不变,而最大振荡频率提高了12%.
郭海君段宝兴袁嵩谢慎隆杨银堂
关键词:高电子迁移率晶体管二维电子气击穿电压
Analysis of the damage threshold of the GaAs pseudomorphic high electron mobility transistor induced by the electromagnetic pulse被引量:3
2016年
An electromagnetic pulse(EMP)-induced damage model based on the internal damage mechanism of the Ga As pseudomorphic high electron mobility transistor(PHEMT) is established in this paper. With this model, the relationships among the damage power, damage energy, pulse width and signal amplitude are investigated. Simulation results show that the pulse width index from the damage power formula obtained here is higher than that from the empirical formula due to the hotspot transferring in the damage process of the device. It is observed that the damage energy is not a constant, which decreases with the signal amplitude increasing, and then changes little when the signal amplitude reaches up to a certain level.
席晓文柴常春刘阳杨银堂樊庆扬史春蕾
关键词:赝配高电子迁移率晶体管电磁脉冲GAAS脉冲宽度经验公式PHEMT
基于遍历干扰对齐的MIMO干扰信道的自由度可达方案设计
2017年
针对K-user MIMO干扰信道,当信道为时变信道或频选信道时,提出了一种基于遍历干扰对齐的自由度上限可达方案,该方案仅通过使用简单的线性预编码和有限个符号设计,就可以获得自由度上限。进而对提出的遍历干扰对齐方案能够达到的系统和速率进行推导,得到了和速率在任意信噪比环境下的闭式表达式。最后通过数值仿真,分析了系统参数对可达和速率的影响。
欧清海何清素曾令康于华东李温静刘芳
关键词:干扰信道多入多出
A Novel Wideband Monopole Antenna Loading Parasitical Patches
A novel wide band monopole antenna employing parasitical patches is presented in this paper.The proposed anten...
Linglong Meng; Weimin Wang; Jinchun Gao; YuananLiu;
关键词:WIDEBANDCOUPLING
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A 600W Broadband Doherty Power Amplifier with Improved Linearity for Wireless Communication System
2017年
An asymmetric Doherty architecture based on three identical transistors is proposed in this paper. This proposed three.way topology reduces the difficulty in designing matching networks brought by the low optimal impedance of high power transistors. And the inverted Doherty topology as well as carefully chosen value of load impedance makes it possible to extend the bandwidth of high power amplifiers. Besides, bias networks of this proposed three.way architecture are also carefully considered to improve the linearity. The proposed high power three.way Doherty power amplifier(3W.DPA) is designed and fabricated based on theoretic analysis. Its maximum output power is about 600 Watts and the drain efficiency is above 35.5% at 9d B back off output power level from 1.9GHz to 2.2 GHz and the saturated drain efficiency is above 47% across the whole frequency band. The measured concurrent two.tone results suggest that the linearity of DPA is improved by at least 5d B.
Jing LiWenhua ChenQian Zhang
关键词:AMPLIFIERLINEARITY
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