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国家自然科学基金(50911130230)

作品数:3 被引量:4H指数:1
相关作者:刘伟乐国敏更多>>
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发文基金:国家自然科学基金教育部留学回国人员科研启动基金更多>>
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放电等离子体烧结镍的形变组织研究(英文)
2011年
利用放电等离子体烧结(SPS)技术制备了粗晶(13μm)和细晶(2μm)两种镍样品。EBSD分析表明,两种烧结样都没有织构,且它们的晶粒都为完全再结晶组织。对此烧结样进行单轴压缩,研究晶粒尺寸对形变中微观组织演变的影响。在样品坐标系中,用每个像素点相对于平均取向的旋转轴来构图,结果显示在一些大晶粒中有扩展的平直界面。滑移迹线和Schmid因子分析表明,这些界面平行于{111}迹线的晶粒,其取向与前人研究的有相同微观组织的大晶粒取向相同。对于SPS烧结的粗晶样和细晶样,几乎每个晶粒内部都发生了一定程度的晶粒分裂。
乐国敏GODFREY Andrew刘伟
关键词:放电等离子体烧结EBSD形变组织
Evaluation of Stored Energy from Microstructure of Multi-component Nanostructured Cu
2012年
A polycrystalline Cu of 99.995% purity has been deformed by dynamic plastic deformation at liquid nitrogen temperature to a strain of 2.1 (LNT-DPD Cu). Three distinct regions that are dominated by dislocation slip, shear banding and nanotwinning, form a multi-component nanostructure. The microstructure of each region has been quantified by transmission electron microscopy assisted by Kikuchi line analysis. Based on the structural parameters the stored energy of each region was evaluated, and the total energy can be assumed to be a linear additivity of that in each region weighted by the respective volume fraction. A microstructure based evaluation of the stored energy of multi-component nanostructure has been proposed.
Feng YanHongwang Zhang
关键词:储存能量纳米铜多组分透射电子显微镜
Quantifying the Microstructures of Pure Cu Subjected to Dynamic Plastic Deformation at Cryogenic Temperature被引量:4
2011年
A pure Cu (99.995 wt%) has been subjected to dynamic plastic deformation at cryogenic temperature to a strain of 2.1. Three types of microstructures that are related to dislocation slip, twinning and shear banding have been quantitatively characterized by transmission electron microscopy (TEM) assisted by convergent beam electron di?raction (CBED) analysis. Microstructures originated from dislocation slip inside or outside the shear bands are characterized by low angle boundaries (<15°) that are spaced in the nanometer scale, whereas most deformation twins are deviated from the perfect Σ3 coincidence (60°/<111>) up to the maximum angle of 9°. The quantitative structural characteristics are compared with those in conventionally deformed Cu at low strain rates, and allowed a quantitative analysis of the flow stress-structural parameter relationship.
F. Yan H. W. Zhang N.R. Tao K. Lu
关键词:纯铜透射电子显微镜位错滑移
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