Molecular dynamics simulations have been performed to explore the atomic-scale sliding friction, especially the stick-slip friction, in a system consisting of a diamond slider and a silver substrate. The mechanisms of the stick-slip behavior are investigated by considering sliding speeds between 10 m/s and 200 m/s.The analyses of the shear distance between the upmost layer and the downmost layer and displacements of a column of atoms in the slider show that shearing deformation of the slider is the main cause of the stick-slip phenomenon. Our simulations also present that a commensurate fit between the two contact surfaces is unimportant for the stick-slip friction.
A review of research on hyste-resis and stick-slip is presented in this paper. Devices for investigating friction hysteresis and stick-slip of linear rolling guide ways are introduced,as well as some experiment results and conclusions,and some factors impacting on stick-slip are also exhibited.
How to describe surface morphology characteristic and microstructure evolution are the hottest researches of current thin film researches. But in traditional characterization of surface morphology, the roughness parameters are scale related. And the microstructure evolution of thin film during post-treatment is usually not considered in detail, To give a better understanding of the roughness of thin films topography, fractal method is carried out. In addition, microstrueture evolution of thin films is analyzed based on the crystallography and energy theory. Cu thin films are deposited on Si （100） substrates by magnetron sputtering, and then annealed at different temperatures. Surface topography is characterized by atomic force microscope （AFM）. Triangular prism surface area （TPSA） algorithm is used to calculate the fractal dimension of the AFM images. Apparent scale effect exists between the surface morphology roughness and film thickness. Relationship between the fractal dimension and roughness is analyzed by linear regression method and linear relationship exists between fractal dimension and surface roughness root mean square （RMS）. Fractal dimension can be characterized as a scale independence parameter to represent the complex degree and roughness level of surface. With the increase of annealing temperature, surface roughness and fractal dimension decrease. But when the annealing temperature exceeds the recrystallization temperature, due to the agglomeration and coalescence of Cu grain, surface roughness and fractal dimension increase. Scale effect and changing regularity of grain growth and shape evolution for different film thickness under different annealing temperatures are analyzed. Based on minimum total free energy, regularity of grain growth and changing is proposed. The proposed research has some theory significance and applicative value of Cu interconnect process and development of MEMS.
This paper presented a numerical approach to solving the problem of a flat-ended punch in contact with a half-space matrix embedded with multiple three dimensional arbitrary-shaped inhomogeneities.Based on the semi-analytical method(SAM)and the equivalent inclusion method,numerical procedures were developed and the effects of inclusion shape and distribution were analyzed.Fast Fourier transform technique was implemented to accelerate the calculation of surface deformation and subsurface stress.Interactions of inter-inclusions and inclusion-matrix were taken into account.Numerical results showed the presence of inhomogeneities(i.e.,microstructures in solids)indeed had a great effect on local contact pressure and a strong disturbance to the subsurface stress field in the vicinity of inclusions.The effects were dependent on the shape and distribution of inclusions and inter-inclusion interactions.The physical significance of this study is to provide an insight into the relation between the material microstructure and its response to the external load,and the solution approach and procedures may find useful applications,for example,the analysis of fatigue and crack propagation for composite materials,prediction of stress field in solids containing material defects,and study of the mechanism of chemical-mechanical polish(CMP)for inhomogeneous materials,etc.
WANG LeiWANG WenZhongWANG ZhanJiangWANG HuiMA TianBaoHU YuanZhong
