Three-dimensional molecular dynamics simulations are carried out to study the mechanism of nanometric processing of ion implanted monocrystalline silicon surfaces. Lattice transformation is observed during implantation and nano-indentation using radial distribution function and geometric criterion damage detection. Nano-indentation is simulated to study the changes of mechanical property. Implantation analysis shows the existence of amorphous phase.Indentation process shows the lattice evolution, which is beneficial for reducing fractures during processing. The indentation results reveal the reduction of brittleness and hardness of the implanted surface. The ion fluence is in direct proportion to the damage, and inverse to the hardness of the material. Experiments of ion implantation, nanoindentation, nano-scratching and nanometric cutting were carried out to verify the simulation results.
Molecular dynamic simulations are performed to study the nanoscratching behavior of polymers.The effects of scratching depth,scratching velocity and indenter/polymer interaction strength are investigated.It is found that polymer material in the scratching zone around the indenter can be removed in a ductile manner as the local temperature in the scratching zone exceeds glass transition temperature Tg.The recovery of polymer can be more significant when the temperature approaches or exceeds Tg.The tangential force,normal force and friction coefficient increase as the scratching depth increases.A larger scratching velocity leads to more material deformation and higher pile-up.The tangential force and normal force are larger for a larger scratching velocity whereas the friction coefficient is almost independent of the scratching velocities studied.It is also found that stronger indenter/polymer interaction strength results in a larger tangential force and friction coefficient.
